In electronics and structural assembly, adhesives play a critical role in ensuring mechanical strength, dimensional stability, and long-term reliability. Process stability depends on tightly controlling parameters such as dispensing path, volume, pause timing, curing energy, and environmental conditions. Even minor deviations can lead to insufficient bonding, air entrapment, or premature degradation—especially in fine-pitch or high-reliability assemblies.

Speeds up adhesive process development by surfacing what works—and what doesn't

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Reduces variability caused by operator decisions or ambient changes

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Enables reproducible process transfers between lines or sites

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Improves reliability validation through structured parameter tracking

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• Yieldmanager supports engineers in defining dispensing and curing parameters based on historical trial data, datasheets, and stored application recipes
• It captures process parameters in real time from the dispenser (e.g. pressure, path velocity, dispense height) and curing system (e.g. UV intensity, duration, thermal profile)
• Visual inspection results, bondline quality, and mechanical strength tests (e.g. shear or peel force) are linked directly to each parameter set
• Engineers can annotate each test with comments on equipment behavior, material handling, or observed anomalies
• Analytics tools highlight trends and performance clusters, flagging unstable parameter combinations or aging effects in adhesives
• The system proposes optimal windows for curing profiles or dispensing speeds, based on statistical correlation to test outcomes
• All results are version-controlled and searchable, providing full traceability and enabling comparison across materials, nozzles, or equipment generations

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Higher bonding consistency and process confidence

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Accelerated root cause analysis for failed bonds

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Fully documented adhesive workflows with traceable settings, results, and observations

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