In surface mount technology (SMT), reflow soldering is critical for forming robust electrical and mechanical connections. The quality of solder joints is highly sensitive to thermal gradients, time above liquidus (TAL), and temperature uniformity across multilayer PCBs. Deviations in zone temperatures, conveyor speed, or layout-specific heat distribution often lead to defects such as tombstoning, cold joints, voiding, or component misalignment—especially in high-density or mixed-mass assemblies.

Accelerates reflow tuning by visualizing the impact of each parameter on yield.

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Improves defect root cause analysis through synchronized thermal and inspection data.

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Ensures consistent documentation and reproducibility across shifts and sites.

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Enables rapid adaptation of reflow settings for new layouts or board materials.

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• Yieldmanager supports engineers in defining reflow profiles by suggesting initial parameters—zone temperatures, ramp/soak times, conveyor speed, nitrogen flow—based on datasheets, prior builds, and its structured knowledge base
• It automatically records real-time thermal curves from thermocouples or oven sensors and associates them with each board or lot ID
• Inspection data from AOI, X-ray, or ICT systems is linked directly to thermal histories, enabling one-to-one defect correlation
• Engineers can document process events inline—such as operator actions, deviations, or equipment alarms—via contextual annotations
• Built-in analytics identify relationships between thermal behavior and defect rates, enabling targeted adjustments to soak duration, peak temp, or cooling slope
• Based on historical performance, the system recommends process refinements by PCB design, solder alloy, or oven type
• All profile runs are fully version-controlled and traceable, supporting NPI validation, cross-line deployment, and process audits

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Highly optimized reflow processes with quantifiable quality improvements.

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Engineering-grade traceability for every profile iteration and related outcome.

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Confident deployment of validated reflow profiles across production lines or facilities.

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